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samtec inc. www.samtec.com phone: 812-944-6733 520 park east blvd. 1-800-samtec-9 (us & canada) fax: 812-948-5047 new albany in 47151-1147 usa sig@samtec.com report revision: 5/20/2005 ?samtec, inc. 2005 all rights reserved high speed characterization report qts-016-03-l-d-dp-a mated with qss-016-01-l-d-dp-a description: parallel board-to-board, 0.635mm pitch, 11mm (0.433?) stack height,
high speed characterization report series: qss-dp/qts-dp description: parallel board-to-board, 0.635mm pitch, 11mm (0.433?) stack height samtec inc. www.samtec.com phone: 812-944-6733 520 park east blvd. 1-800-samtec-9 (us & canada) fax: 812-948-5047 new albany in 47151-1147 usa sig@samtec.com report revision: 5/20/2005 ?samtec, inc. 2005 page:ii all rights reserved table of contents connector ov erview ........................................................................................................ 1 connector system speed rati ng .................................................................................... 1 frequency domain da ta summa ry ................................................................................. 2 table 1 - differential connec tor system bandwid th .................................................... 2 time domain da ta summary .......................................................................................... 3 table 2 - differential impedance ( ? )............................................................................ 3 table 3 - differentia l crosstal k (%) .............................................................................. 3 table 4 - propagation dela y (mated c onnector) ......................................................... 3 characterizati on details .................................................................................................. 4 differentia l data ........................................................................................................... 4 connector signal to ground ra tio ............................................................................... 4 frequency domain data.............................................................................................. 6 time domain data....................................................................................................... 6 appendix a ? frequency doma in respons e graphs...................................................... 8 differential applicatio n ? insertio n loss....................................................................... 8 differential applicatio n ? return loss.......................................................................... 8 differential applic ation ? next ................................................................................... 9 differential applic ation ? fext .................................................................................... 9 appendix b ? time doma in respons e graphs ............................................................. 10 differential applicatio n ? input pulse ......................................................................... 10 differential applic ation ? im pedance ......................................................................... 11 differential applicatio n ? propagation delay.............................................................. 11 differential application ? next, ?worst case? c onfigurat ion .................................... 12 differential application ? fext, ?worst case? c onfigurat ion..................................... 12 differential application ? next , across power /ground blad e .................................. 13 differential application ? fext , across power /ground blad e................................... 13 appendix c ? product and test system de scripti ons................................................... 14 product descr iption ................................................................................................... 14 test system descripti on............................................................................................ 14 appendix d ? test and m easurement setup................................................................. 16 test instru ments ........................................................................................................ 17 measurement stati on accesso ries ............................................................................ 17 test cables & adapter s............................................................................................. 17 appendix e - frequency and time domain meas urements .......................................... 18 frequency (s-parameter) domain pr ocedures ......................................................... 18 csa8000 se tup ..................................................................................................... 18 insertion loss......................................................................................................... 19 return loss............................................................................................................ 19 near-end crosstalk (next ) ................................................................................... 19 far-end crosstal k (fext )...................................................................................... 20
high speed characterization report series: qss-dp/qts-dp description: parallel board-to-board, 0.635mm pitch, 11mm (0.433?) stack height samtec inc. www.samtec.com phone: 812-944-6733 520 park east blvd. 1-800-samtec-9 (us & canada) fax: 812-948-5047 new albany in 47151-1147 usa sig@samtec.com report revision: 5/20/2005 ?samtec, inc. 2005 page:iii all rights reserved time domain procedur es .......................................................................................... 21 impedance ............................................................................................................. 21 propagation de lay.................................................................................................. 21 crosstal k ................................................................................................................ 21 appendix f ? glossa ry of terms................................................................................... 22
high speed characterization report series: qss-dp/qts-dp description: parallel board-to-board, 0.635mm pitch, 11mm (0.433?) stack height samtec inc. www.samtec.com phone: 812-944-6733 520 park east blvd. 1-800-samtec-9 (us & canada) fax: 812-948-5047 new albany in 47151-1147 usa sig@samtec.com report revision: 5/20/2005 ?samtec, inc. 2005 page:1 all rights reserved connector overview q strip? .635mm (.025?) pitch interfaces (qss /qts series) are available with up to 160 i/os and with standard board-to-board spacing of 5mm (0.197"), 8mm (0.315"), 11mm (0.433"), and 16mm (0.630") between boards. the data in this report is applicable only to the differential pair 11mm (0.433" ) board-to-board stack height version. connector system speed rating qss-dp/qts-dp series, parallel board-to-board, 0.635mm pitch, 11 mm (0.433") stack height signaling speed rating differential: 6.0 ghz / 12 gbps the speed rating is based on the -3 db inse rtion loss point of the connector system. the -3 db point can be used to estimate us able system bandwidth in a typical, two-level signaling environment. to calculate the speed rating, the measured -3 db point is rounded up to the nearest half-ghz level. the up-rounding corrects for a portion of the test board?s trace loss, since trace losses are included in the loss data in this report. the resulting loss value is then doubled to determine the appr oximate maximum data rate in gigabits per second (gbps). for example, a connector with a -3 db point of 7.8 ghz would have a speed rating of 8 ghz/ 16 gbps. a connector with a -3 db poi nt of 7.2 ghz would have a speed rating of 7.5 ghz/ 15 gbps.
high speed characterization report series: qss-dp/qts-dp description: parallel board-to-board, 0.635mm pitch, 11mm (0.433?) stack height samtec inc. www.samtec.com phone: 812-944-6733 520 park east blvd. 1-800-samtec-9 (us & canada) fax: 812-948-5047 new albany in 47151-1147 usa sig@samtec.com report revision: 5/20/2005 ?samtec, inc. 2005 page:2 all rights reserved frequency domain data summary table 1 - differential conn ector system bandwidth test parameter configuration insertion loss . ss . -3db @ 5.86ghz return loss . ss . < -5db to 5.86ghz . aa . qq . < -18db to 5.86ghz near-end crosstalk xrow, aa to qq < -28db to 5.86ghz . aa . qq . < -30db to 5.86ghz far-end crosstalk xrow, aa to qq < -32db to 5.86ghz pcb/connector test system diffe re ntial application serie s qss-01 / qts-03 -9 -8 -7 -6 -5 -4 -3 -2 -1 0 1 0.0 1.0 2.0 3.0 4.0 5.0 6.0 frequency (ghz) insertion loss (db) differential
high speed characterization report series: qss-dp/qts-dp description: parallel board-to-board, 0.635mm pitch, 11mm (0.433?) stack height samtec inc. www.samtec.com phone: 812-944-6733 520 park east blvd. 1-800-samtec-9 (us & canada) fax: 812-948-5047 new albany in 47151-1147 usa sig@samtec.com report revision: 5/20/2005 ?samtec, inc. 2005 page:3 all rights reserved time domain data summary table 2 - differential impedance ( ? ) signal risetime 305ps 50 ps 100 ps 250 ps 500 ps 750 ps 1 ns maximum impedance 103.5 103.3 103.0 102.6 102.4 102.1 101.8 minimum impedance 65.8 69.1 74.8 82.9 89.1 92.6 94.5 d ifferential a pplicatio n impedance vs. risetime 50 60 70 80 90 10 0 110 12 0 35 50 100 250 500 750 1000 risetime (psec) impedance (ohms) maximum minimum table 3 - differential crosstalk (%) input (t r ) 305ps 50 ps 100 ps 250 ps 500 ps 750 ps 1 ns . aa . qq . 2.1 2.0 1.7 1.1 < 1.0 < 1.0 < 1.0 next xrow diff < 1.0 < 1.0 < 1.0 < 1.0 < 1.0 < 1.0 < 1.0 . aa . qq . < 1.0 < 1.0 < 1.0 < 1.0 < 1.0 < 1.0 < 1.0 fext xrow dif < 1.0 < 1.0 < 1.0 < 1.0 < 1.0 < 1.0 < 1.0 table 4 - propagation delay (mated connector) differential 115.0 ps
high speed characterization report series: qss-dp/qts-dp description: parallel board-to-board, 0.635mm pitch, 11mm (0.433?) stack height samtec inc. www.samtec.com phone: 812-944-6733 520 park east blvd. 1-800-samtec-9 (us & canada) fax: 812-948-5047 new albany in 47151-1147 usa sig@samtec.com report revision: 5/20/2005 ?samtec, inc. 2005 page:4 all rights reserved characterization details this report presents data which characterizes the signal integrity response of a connec- tor pair in a controlled printed circuit board (pcb) environment. all efforts are made to reveal typical best-case responses inher ent to the system under test (sut). in this report, the sut inclu des the test pcb from drive side probe tips to receive side probe tips. pcb effects are not removed or de-embedded from t he test data. pcb de- signs with impedance mismatch, large losses, skew, cross talk, or similar impairments can have a significant impact on observed test data. therefor e, great design effort is put forth to limit these effect s in the pcb utilized in these tests. some board related ef- fects, such as pad-to-ground capacitance and trace loss, are incl uded in the data pre- sented in this report. but other effects, such as via coupling or stub resonance, are not evaluated here. such effect s are addressed and characterized fully by the samtec final inch? products. additionally, intermediate test signal c onnections can mask the connectors? true per- formance. such connection effects are mi nimized by using high performance test ca- bles, adapters, and microwave probes. where appropriate, calibration and de- embedding routines are also used to reduce residual effects. differential data most samtec connectors can be used successfu lly in both differential and single-ended applications. however, electrical perform ance will differ depending on the signal drive type. in this report, data is presented fo r a differentially driven only scenario where every third pin of t he standard samtec connector is removed. connector signal to ground ratio samtec connectors are most often desi gned for generic applications, and can be im- plemented using various signal and ground pi n assignments. in high speed systems, provisions must be made in the interconnect fo r signal return currents. such paths are often referred to as ?ground?. in some conne ctors, a ground plane or blade, or an outer shield is used as the signal return, while in others, connector pins are used as signal returns. various combinations of signal pins, ground blades, and shields can also be utilized. electrical performance can vary significantly depending upon the number and location of ground pins. in general, the more pins dedicated to ground, the better electrical performance will be. but dedicating pins to ground reduces signal dens ity of a connector. so care must be taken when choosing signal/ground ratios in cost- or density-sensitive applications.
high speed characterization report series: qss-dp/qts-dp description: parallel board-to-board, 0.635mm pitch, 11mm (0.433?) stack height samtec inc. www.samtec.com phone: 812-944-6733 520 park east blvd. 1-800-samtec-9 (us & canada) fax: 812-948-5047 new albany in 47151-1147 usa sig@samtec.com report revision: 5/20/2005 ?samtec, inc. 2005 page:5 all rights reserved for this connector, the following configurations were evaluated: differential impedance : ? ss (positive signal-negative signal) differential crosstalk : ? electrical ?worst case?: . aa . qq . 1.12mm spacing-active-active-1.12mm spac- ing -quiet-quiet-1.12mm spacing) ? across row:xrow diff (from one row of terminals to the other row across the iso- lated ground blade, same spacing within the row) in all cases in this report, the center ground blade of the connector was grounded to the pcb. only one differential pair was driven for crosstalk measurements. other configurations can be ev aluated upon request. please contact sig@samtec.com for more information. in a real system environment, active signals might be located at the outer edges of the signal contacts of concern, as opposed to the ground signals utilized in laboratory test- ing. for example, in a si ngle-ended system, a pin-out of ? ssss?, or four adjacent single ended signals, might be encountered, as oppos ed to the ?gsg? and ?gssg? configura- tions tested in the laboratory. electrical c haracteristics in such applications could vary slightly from laboratory results. but in most applications, performance can safely be con- sidered equivalent.
high speed characterization report series: qss-dp/qts-dp description: parallel board-to-board, 0.635mm pitch, 11mm (0.433?) stack height samtec inc. www.samtec.com phone: 812-944-6733 520 park east blvd. 1-800-samtec-9 (us & canada) fax: 812-948-5047 new albany in 47151-1147 usa sig@samtec.com report revision: 5/20/2005 ?samtec, inc. 2005 page:6 all rights reserved signal edge speed (rise time): in pulse signaling applications, the perceiv ed performance of an interconnect can vary significantly depending on the edge rate or rise ti me of the exciting si gnal. for this re- port, the fastest rise time used was 30 +/-5 ps. genera lly, this should demonstrate worst case performance. in many systems, the signal edge rate will be significantly slower at the connector than at the driver launch point. to estimate interconnect performance at other edge rates, data is provided for several rise times between 30 ps and 1.0 ns. for this report, rise times were measured at 10%-90% signal levels. frequency domain data frequency domain parameters are helpful in evaluating the connector system?s signal loss and crosstalk characteristics across a range of sinusoidal frequencies. in this re- port, parameters presented in the frequency domain are inserti on loss, return loss, and near-end and far-end crosstalk. other parameters or formats, such as vswr or s- parameters, may be availabl e upon request. please contact our signal integrity group at sig@samtec.com for more information. frequency performance characteristics for t he sut are generated from time domain measurements using fourier transform calcul ations. procedures and methods used in generating the sut?s frequency domain data are provided in the frequency domain test procedures in appendix e of this report. time domain data time domain parameters indicate impedance mismatch versus length, signal propaga- tion time, and crosstalk in a pulsed signal en vironment. time domain data is provided in appendix e of this report. paramete rs or formats not inclu ded in this report may be available upon request. please contact our signal int egrity group at sig@samtec.com for more information. reference plane impedance is 10 0 ohms for differential meas urements. the fastest risetime signal exciting the su t is 30 5 picoseconds. in this report, propagation delay is defi ned as the signal propagation time through the pcb connector pads and connector pair. it does not include pcb traces. delay is measured at 30 5 picoseconds signal risetime . delay is calculated as the difference in time measured between the 50% amplitude levels of the input and output pulses.
high speed characterization report series: qss-dp/qts-dp description: parallel board-to-board, 0.635mm pitch, 11mm (0.433?) stack height samtec inc. www.samtec.com phone: 812-944-6733 520 park east blvd. 1-800-samtec-9 (us & canada) fax: 812-948-5047 new albany in 47151-1147 usa sig@samtec.com report revision: 5/20/2005 ?samtec, inc. 2005 page:7 all rights reserved crosstalk or coupled noise data is provided fo r various signal confi gurations. all meas- urements are single disturber. cr osstalk is calculated as a ra tio of the input line voltage to the coupled line voltage. the input line is sometimes described as the active or drive line. the coupled line is sometimes described as the quiet or victim line. crosstalk ratio is tabulated in this report as a percent age. measurements are made at both the near- end and far-end of the sut. data for other configurations may be availa ble. please contact our signal integrity group at sig@samtec.com for further information. as a rule of thumb, 10% crosstalk levels ar e often used as a general first pass limit for determining acceptable interconnect perform ance. but modern system crosstalk toler- ance can vary greatly. for advice on connect or suitability for specific applications, please contact our signal integrity group at sig@samtec.com . additional information concer ning test conditions and procedures is located in the ap- pendices of this report. further informati on may be obtained by contacting our signal integrity group at sig@samtec.com .
high speed characterization report series: qss-dp/qts-dp description: parallel board-to-board, 0.635mm pitch, 11mm (0.433?) stack height samtec inc. www.samtec.com phone: 812-944-6733 520 park east blvd. 1-800-samtec-9 (us & canada) fax: 812-948-5047 new albany in 47151-1147 usa sig@samtec.com report revision: 5/20/2005 ?samtec, inc. 2005 page:8 all rights reserved appendix a ? frequency domain response graphs differential application ? insertion loss pcb/connector test system diffe re ntial application serie s qss-01 / qts-03 -9 -8 -7 -6 -5 -4 -3 -2 -1 0 1 0.0 1.0 2.0 3.0 4.0 5.0 6.0 frequency (ghz) insertion loss (db) differential differential application ? return loss pcb/connector test system diffe re ntial application serie s qss-01 / qts-03 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 0.0 1.0 2.0 3.0 4.0 5.0 6.0 frequency (ghz) return loss (db) differential
high speed characterization report series: qss-dp/qts-dp description: parallel board-to-board, 0.635mm pitch, 11mm (0.433?) stack height samtec inc. www.samtec.com phone: 812-944-6733 520 park east blvd. 1-800-samtec-9 (us & canada) fax: 812-948-5047 new albany in 47151-1147 usa sig@samtec.com report revision: 5/20/2005 ?samtec, inc. 2005 page:9 all rights reserved differential application ? next pcb/connector test system diffe re ntial application serie s qss-01 / qts-03 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 0.0 1.0 2.0 3.0 4.0 5.0 6.0 frequency (ghz) near-end crosstalk (db) w orst case best case across ground blade differential application ? fext pcb/connector test system diffe re ntial application serie s qss-01 / qts-03 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 0.0 1.0 2.0 3.0 4.0 5.0 6.0 frequency (ghz) far-end crosstalk (db) w orst case best case across ground blade
high speed characterization report series: qss-dp/qts-dp description: parallel board-to-board, 0.635mm pitch, 11mm (0.433?) stack height samtec inc. www.samtec.com phone: 812-944-6733 520 park east blvd. 1-800-samtec-9 (us & canada) fax: 812-948-5047 new albany in 47151-1147 usa sig@samtec.com report revision: 5/20/2005 ?samtec, inc. 2005 page:10 all rights reserved appendix b ? time domain response graphs differential application ? input pulse
high speed characterization report series: qss-dp/qts-dp description: parallel board-to-board, 0.635mm pitch, 11mm (0.433?) stack height samtec inc. www.samtec.com phone: 812-944-6733 520 park east blvd. 1-800-samtec-9 (us & canada) fax: 812-948-5047 new albany in 47151-1147 usa sig@samtec.com report revision: 5/20/2005 ?samtec, inc. 2005 page:11 all rights reserved differential application ? impedance differential application ? propagation delay
high speed characterization report series: qss-dp/qts-dp description: parallel board-to-board, 0.635mm pitch, 11mm (0.433?) stack height samtec inc. www.samtec.com phone: 812-944-6733 520 park east blvd. 1-800-samtec-9 (us & canada) fax: 812-948-5047 new albany in 47151-1147 usa sig@samtec.com report revision: 5/20/2005 ?samtec, inc. 2005 page:12 all rights reserved differential application ? next , ?worst case? configuration differential application ? fext , ?worst case? configuration
high speed characterization report series: qss-dp/qts-dp description: parallel board-to-board, 0.635mm pitch, 11mm (0.433?) stack height samtec inc. www.samtec.com phone: 812-944-6733 520 park east blvd. 1-800-samtec-9 (us & canada) fax: 812-948-5047 new albany in 47151-1147 usa sig@samtec.com report revision: 5/20/2005 ?samtec, inc. 2005 page:13 all rights reserved differential application ? n ext, across power/ground blade differential application ? f ext, across power/ground blade
high speed characterization report series: qss-dp/qts-dp description: parallel board-to-board, 0.635mm pitch, 11mm (0.433?) stack height samtec inc. www.samtec.com phone: 812-944-6733 520 park east blvd. 1-800-samtec-9 (us & canada) fax: 812-948-5047 new albany in 47151-1147 usa sig@samtec.com report revision: 5/20/2005 ?samtec, inc. 2005 page:14 all rights reserved appendix c ? product and test system descriptions product description product samples are the 11mm (0.433?) sta ck height q strip? high speed qss series sockets p/n qss-016-01-x-d-dp-a and t he mating qts series header p/n qts-016- 03-x-d-dp-a. each connector structure consists of 2 rows of eight terminal pairs mounted into a plas- tic housing with a surface mount design. a conductive ground/power blade lies length- wise between terminal rows in the housing. ev ery third signal pin is removed from each row creating 1.12mm spacing bet ween differential signal pins. signal contacts are at a.635mm (.025? ) pitch. test system description the test fixtures are composed of a 4-layer fr-4 material with 50 ? and100 ? signal trace and pad configurations designed for the elec trical characterization of samtec hi- speed connector products. the pictured fixtur es are specific to the qss/qts series connector and are identified by samtec p/n pcb-100245-ts t-01 and p/n pcb- 100245-tst-02 (figure 1) terminated onto p/n pcb-100245-t st-01 (figure 2) are three qss socket series con- nectors. a 25position (rt.) standard connector is setup for characterizing single ended type signals (gsg). the 50 position connector (lt.) characterizes differential type sig- nals(gssg) with adjacent signal pins positi ons assigned as grounds. the 16 pair cen- ter connector characterizes differential pairs in a totally open pin field designation. this report characterizes the si response of the 16 pair differential connector. figure 1 mated pcb test fixture with mounted test connectors
high speed characterization report series: qss-dp/qts-dp description: parallel board-to-board, 0.635mm pitch, 11mm (0.433?) stack height samtec inc. www.samtec.com phone: 812-944-6733 520 park east blvd. 1-800-samtec-9 (us & canada) fax: 812-948-5047 new albany in 47151-1147 usa sig@samtec.com report revision: 5/20/2005 ?samtec, inc. 2005 page:15 all rights reserved p/n pcb-100245-tst-02 accepts the qts terminal connector s (figure 3) and is de- signed to mate with pcb-100245-tst-01. de sign differences are that signal traces propagate through the board and are located on the opposite side from the mating con- nectors. qts trace transitions can be obs erved on the top board in figure 1. test point signal paths co incide with each other upon mating and are marked accord- ingly. differential signal terminal paths for the 16 pair connector are j6_8, j10_12, and j9_11. all signal paths are for monitori ng through or adjacent signaling test condi- tions with the exception of j 9_11. this condition is setup for monitoring signal coupling across terminal rows. the differential fixtures ?j? number represent s each terminal?s designated position within the connector. signals can be launched or re ceived from either the socket or header side of the connector. all dat a and waveforms presented in t he report are results from a socket side signal launch. figure 2 (lt. to rt.) qss-050-01-x-d-a , qss-016-01-x-d-dp-a, qss-025-01-x-d-a figure 3 (lt. to rt.) qts-050-01-x-d-a, qts-016-03-x-d-dp-a, qts-025-01-x-d-a
high speed characterization report series: qss-dp/qts-dp description: parallel board-to-board, 0.635mm pitch, 11mm (0.433?) stack height samtec inc. www.samtec.com phone: 812-944-6733 520 park east blvd. 1-800-samtec-9 (us & canada) fax: 812-948-5047 new albany in 47151-1147 usa sig@samtec.com report revision: 5/20/2005 ?samtec, inc. 2005 page:16 all rights reserved appendix d ? test and measurement setup test instruments are a tekt ronix csa8000 communication signal analyzer mainframe and the agilent 8720es vector network analyze r. four bays of the csa8000 are oc- cupied with three tektronix 80e04 t dr/sampling heads and one tektronix 80e03 sampling head. for this series of tests, four of the eight t dr/sampling head capability is used (figure 4) . the 8720es serves as a supporting test instrument for verification or troubleshooting results obtained from t he tda systems iconnect software package. iconnect is a tdr based measurement software tool used in generating frequency do- main related responses from high speed interconnects. the probe stations illuminated video microscopy system, microprobe positioners, and 40ghz capable probes provide bot h the mechanical properties and electrical character- istics for obtaining the precise signal launch and calibrations that are critical in obtaining accurate high speed measurements. the 450 micron pitch probes are located to pcb launch points with 25x to 175x magnifica tion and xyz fine positioning adjustments available from both the probe table and micro- probe positioners. elec trically the micro- wave probes rate a < 1.0 db insertion loss, a < 18 db return loss, and an isolation of 38 db to 40 ghz (figure 4) . test cables and interconnec t adapters are high quality and insure high-bandwidth and low parasitic measurements. figure 4 ? probe station measurements capability
high speed characterization report series: qss-dp/qts-dp description: parallel board-to-board, 0.635mm pitch, 11mm (0.433?) stack height samtec inc. www.samtec.com phone: 812-944-6733 520 park east blvd. 1-800-samtec-9 (us & canada) fax: 812-948-5047 new albany in 47151-1147 usa sig@samtec.com report revision: 5/20/2005 ?samtec, inc. 2005 page:17 all rights reserved test instruments qty description 1 tektronix csa8000 comm unication signal analyzer 3 tektronix 80e04 dual channel 20 ghz tdr sampling module 1 tektronix 80e03 dual channel 20 ghz sampling module 1 agilent 8720es vector networ k analyzer, 50 mhz to 20 ghz measurement station accessories qty description 1 gigatest labs model (gtl3030) probe station 4 gtl micro-probe positioners 2 picoprobe by ggb ind. model 40a gsg (single ended applications) 2 picoprobe by ggb ind. dual model 40a gsg-gsg (differential applications) 1 keyence vh-5910 high resolution video microscope 1 keyence vh-w100 fixed magnification lens 100 x 1 keyence vh-z25 standard zoom lens 25x-175x 1 cs-9 gsg picoprobe cali bration substrate (u9450.sq) 1 cs-11 gs-sg picoprobe cali bration substrate (u11450.sq) test cables & adapters qty description 4 micro-coax cable assembly 48? 3. 5mm male to 3.5mm female, 26.5 ghz (il = .33 db@ 10 ghz) 2 huber-suhner cable assembly 36? sm a female to sma female 26.5 ghz (il = .34 db @ 10 ghz) 4 pasternack precision adapters, 3. 5 mm male to 2.9(k) male, max.vswr 1.25 @ 34ghz figure 5 ? 40 ghz high performance microwave probes
high speed characterization report series: qss-dp/qts-dp description: parallel board-to-board, 0.635mm pitch, 11mm (0.433?) stack height samtec inc. www.samtec.com phone: 812-944-6733 520 park east blvd. 1-800-samtec-9 (us & canada) fax: 812-948-5047 new albany in 47151-1147 usa sig@samtec.com report revision: 5/20/2005 ?samtec, inc. 2005 page:18 all rights reserved appendix e - frequency and time domain measurements it is important to note bef ore gathering measurement dat a that tda systems iconnect measurements and csa8000 meas urements are virtually t he same measurements with diverse formats. this means that the operat or, being extremely aware, can obtain si time and frequency characteristics in an almost simultaneous fashion. since iconnect setup procedures are specific to the fre quency information sought, it is mandatory that the sample preparation and csa8000 functional setups be consistent throughout the waveform gathering process. if the operators test equipment permits recall sequencing between the various test par ameter setups, it insures iconnect func- tional setups remain consistent with the t dr/tdt waveforms previously recorded. re- lated time and frequency test parameter data re corded for this report were gathered si- multaneously. frequency (s-parameter) domain procedures frequency data extraction involves two steps that first measure the frequency related time domain waveform followed by post-proce ssing of the time domain waveforms into loss and crosstalk response parameters versus frequency. the first step utilizes the tektronix csa8000 time based instrument to capture fr equency related single-ended or differential signal types pr opagating through an appropriately prepared sut. the sec- ond step involves a correlation of the time based waveforms using the tda systems iconnect software tool to post-process these waveforms into frequency response pa- rameters. tda systems labels these frequency related waveform relationships as the step and dut reference. this report establishes the setup procedures for defining the step and dut reference for frequency parameters of interest. once established, the step and dut references are post-processed in iconnect?s s-paramet er computations window. csa8000 setup listed below are the csa 8000 functional me nu setups used for single-ended and dif- ferential frequency response extractions. both signal types utilize i-connect software tools to generate s-paramet er upper and lower frequency boundaries along with the step frequency. these frequency boundaries are determined by a time domain instru- ments functional settings such as window length, number of points and averaging capa- bility. once window length, number of point s and averaging functions are set, maintain the same instrument settings thr oughout the extraction process.
high speed characterization report series: qss-dp/qts-dp description: parallel board-to-board, 0.635mm pitch, 11mm (0.433?) stack height samtec inc. www.samtec.com phone: 812-944-6733 520 park east blvd. 1-800-samtec-9 (us & canada) fax: 812-948-5047 new albany in 47151-1147 usa sig@samtec.com report revision: 5/20/2005 ?samtec, inc. 2005 page:19 all rights reserved differential signal vertical scale: 100 mv/ div: offset: default / scroll horizontal scale: 1nsec/ div = 20 mhz step frequency max. record length: 4000 = min. resolution averages: 128 insertion loss sut preparation ? use the j6_8 or j10_12 signal path (figure 1 ) to establish the dif- ferential through transmission waveform . terminate any adjacent signal paths into a 100 ? characteristic impedance. step reference ? establish the waveform by maki ng a tdt transmission measurement that includes all cables, adapt ers, and probes connected in the test systems transmis- sion path. the through transmission is acco mplished by inserting a negligible length of transmission standard (figure 5) between the microwave probes. dut reference - establish the waveform by maki ng an active tdt transmission meas- urement that includes the su t and all cables, adapters, and probes connected in the test systems transmission path. return loss use the j6_8 or j10_12 signal path (figure 1 ) to establish a tdr matched response waveform . terminate any adjacent signal paths into a 100 ? characteristic impedance. step reference - establish the waveform by making a tdr measurement of the input cables and adapters leading to an open probe condition on t he near end of the test sys- tem. dut reference - establish the waveform by ma king a tdt (matched) transmission measurement that includes a ll cables, adapters, and probes c onnected in the test sys- tems transmission path (figure 5). cables and adapters locat ed at the far-end of the sut serve as the test systems characterisitic impedance match. near-end crosstalk (next ) sut preparation ? terminate -02 terminal fixture (figure 2) probe pad locations j 6_8, j10_12 & j9_11 at a 100 ? characteristic impedance .
high speed characterization report series: qss-dp/qts-dp description: parallel board-to-board, 0.635mm pitch, 11mm (0.433?) stack height samtec inc. www.samtec.com phone: 812-944-6733 520 park east blvd. 1-800-samtec-9 (us & canada) fax: 812-948-5047 new albany in 47151-1147 usa sig@samtec.com report revision: 5/20/2005 ?samtec, inc. 2005 page:20 all rights reserved step reference - establish the waveform by making a tdr measurement of the input cables and adapters leading to an open probe condition on t he near end of the test sys- tem. dut reference - establish the waveform by drivi ng signal line j10_12 and monitoring worse case coupled energy at j6_8, both loca ted on the -01 socket fi xture. repeat the same procedure for across row coupling condition j9_11. far-end crosstalk (fext) sut preparation - terminate -01 socket fixture (figure 2) probe pad locations j6_8, & j9_11 at 100 ? impedances . terminate -02 terminal fixture (figure 2) probe pad locations j10_12, & j9_11 at a100 ? characteristic impedance . step reference - establish this waveform by making a tdt transmission measurement that includes all cables, adapt ers, and probes connected in the test systems transmis- sion path. the transmission path is completed by inserting a negligible length of trans- mission standard (figure 5) between the microwave probes. dut reference - establish the waveform by driving -01 socket fixture signal line j10_12 and monitoring best case coupled energy at j6_8 of the -02 terminal fixture . repeat procedure for across row condition at j9_11.
high speed characterization report series: qss-dp/qts-dp description: parallel board-to-board, 0.635mm pitch, 11mm (0.433?) stack height samtec inc. www.samtec.com phone: 812-944-6733 520 park east blvd. 1-800-samtec-9 (us & canada) fax: 812-948-5047 new albany in 47151-1147 usa sig@samtec.com report revision: 5/20/2005 ?samtec, inc. 2005 page:21 all rights reserved time domain procedures measurements involving digital type pulses ar e performed utilizing either time domain reflectometer (tdr) or time domain transmi ssion (tdt) methods. for this series of tests, tdr methods are employed for the impedance and propaga tion delay measure- ments. crosstalk measurem ents utilize tdt methods. the tektronix 80e04 tdr/ sam- pling head provide both the signaling type and sampling c apability necessary to accurately and fully char acterize the sut. impedance the signal line(s) of the sut?s signal config uration is energized with a tdr pulse. the far-end of the energized signal li ne is terminated in the test systems characteristic im- pedance (e.g.; 50 ? or 100 ? terminations). by terminating the adjacent signal lines in the test systems characteristic impedanc e, the effects on t he resultant impedance shape of the waveform is limited. propagation delay this connector series uses the fastes t edge rate (30ps) of the tdr impedance wave- form to measure propagation dela y. differential mated connec tor delay is the measured difference of propagation between known signal trace length delays and the delay of the mated sut. the measurement is a one-way propagation result. termination of the ad- jacent signal lines into the test systems characteristic impedance eliminate alternate current paths providing for better measurement accuracy. crosstalk an active pulsed waveform is transmitted through a selected sut signal line. the adja- cent quiet signal lines are m onitored for the coupled energy at the near-end and far-end. active and quiet lines not being monitored ar e terminated in the test systems character- istic impedance. signal lines adjacent to th e quiet lines remain terminated on both ends throughout the test sequence. failing to te rminate the active n ear or far end, quiet lines, or in some cases, signal lines adjac ent to the quiet line may have an effect on amplitude and shape of the coupled energy.
high speed characterization report series: qss-dp/qts-dp description: parallel board-to-board, 0.635mm pitch, 11mm (0.433?) stack height samtec inc. www.samtec.com phone: 812-944-6733 520 park east blvd. 1-800-samtec-9 (us & canada) fax: 812-948-5047 new albany in 47151-1147 usa sig@samtec.com report revision: 5/20/2005 ?samtec, inc. 2005 page:22 all rights reserved appendix f ? glossary of terms bc ? best case crosstalk configuration dp ? differential pair signal configuration dut ? device under test; tda iconnect reference waveform fext ? far-end crosstalk gsg ? ground?signal-ground; g eometric configuration next ? near-end crosstalk pcb ? printed circuit board se ? single-ended si ? signal integrity sut ? system under test tdr ? time domain reflectometry tdt ? time domain transmission wc ? worse case crosstalk configuration xrow se ? cross ground/ power bar cro sstalk, single-ended signal xrow diff ? cross ground/ power bar cro sstalk, differential signal z ? impedance (expressed in ohms)

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